| HS Code | 238719 |
| Appearance | milky white or translucent liquid |
| Particle Diameter Nm | 5-100 |
| Sio2 Content Wt Percent | 30-50 |
| Ph | 8.5-10.5 |
| Density G Per Cm3 | 1.2-1.4 |
| Viscosity Mpa S | 5-20 |
| Specific Surface Area M2 Per G | 50-400 |
| Stabilizing Counterion | sodium (Na2O) |
| Particle Charge | negative (anionic) |
| Stability | excellent under alkaline conditions; gelation at low pH |
| Refractive Index | 1.35-1.45 |
| Solubility | miscible with water in all proportions |
| Freezing Point Degc | approximately 0 |
| Storage Temperature Degc | 5-35 |
As an accredited Silica Sol factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Silica Sol is packaged in 25 kg polyethylene drums, sealed to prevent contamination and evaporation, ensuring safe transport and storage. |
| Container Loading (20′ FCL) | Load 20′ FCL with palletized drums/IBCs of silica sol, securely braced, leak-proof sealed, and evenly distributed to prevent shifting. |
| Shipping | Silica Sol ships in sealed drums, IBC totes, or bulk tankers. Protect from freezing and extreme heat; store upright in ventilated, dry areas. Use approved spill containment and secure loads properly. Although non-hazardous, avoid skin/eye contact and follow standard chemical handling procedures during transport. |
| Storage | Silica Sol should be stored in tightly sealed, corrosion-resistant containers, preferably polyethylene, to prevent evaporation and contamination. Keep in a cool, dry, well-ventilated area away from direct sunlight and extreme temperatures. Avoid freezing, as this causes irreversible gelling. Recommended storage temperature is between 5°C and 35°C. Ensure containers remain sealed when not in use. |
| Shelf Life | Silica Sol shelf life is typically 6-12 months if stored sealed, cool, and frost-free. |
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Silica Sol is an aqueous colloidal dispersion of amorphous silicon dioxide nanoparticles produced by ion exchange of sodium silicate, followed by particle growth, concentration, and surface stabilization. Commercial grades are differentiated by silica content, particle size, pH, and stabilizing counterion. Representative model classes include an alkaline sodium-stabilized grade with 30 wt% SiO₂, 8–12 nm mean diameter, 9.5–10.5 pH, and 0.2–0.6 wt% Na₂O; a large-particle alkaline grade with 40 wt% SiO₂ and 40–80 nm mean diameter; an acidic chloride-stabilized grade at 20 wt% SiO₂, 15–30 nm particle diameter, and 2.0–4.0 pH; and an epoxy-functional surface-modified grade with 25 wt% SiO₂ and 10–25 nm diameter. Typical measured density ranges from 1.08 g/cm³ to 1.38 g/cm³, and dynamic viscosity at 25 °C remains below 10 mPa·s for most stabilized grades. Unlike sodium silicate solution, the product contains discrete non-aggregated particles rather than oligomeric silicate anions, which alters gelation behaviour, alkali release, and drying shrinkage.
Colloid stability in silica sol is governed by surface charge and electrolyte concentration. Alkaline grades exhibit silanol deprotonation and negative zeta potential typically between -30 mV and -60 mV at pH 9.5–10.5. Acidic grades are stabilized by a positive charge at pH 2.0–4.0, with zeta potential above +20 mV. Near the isoelectric point at pH 2.0–3.0, surface charge is insufficient to prevent aggregation, and viscosity increase or gelation occurs. Particle size analysis by dynamic light scattering according to ISO 22412:2017 must therefore be conducted with dilution water adjusted to the native pH range of the grade. Dilution of an alkaline sol into deionized water below pH 7.0 can produce apparent bimodal distributions due to aggregation. Specific surface area by nitrogen adsorption according to ISO 9277:2022 is typically 200–300 m²/g for 8–12 nm grades and 40–100 m²/g for 40–80 nm grades. Free sodium oxide is measured by ion chromatography according to ISO 10304-1:2007, with alkaline grades controlled below 0.6 wt% Na₂O to limit soluble salt interference in ceramic and coating processing. pH is determined with a glass electrode according to ASTM E70. Viscosity is measured at 25 °C by rotational viscometer according to ASTM D2196, with acceptance below 10 mPa·s for most stabilized grades. The aggregation window imposes formulation restrictions: addition of multivalent cations such as Ca²⁺, Mg²⁺, or Al³⁺ above 50–100 ppm can bridge anionic particles and increase viscosity or cause sediment. Amine-based additives can shift pH toward the isoelectric region in acidic grades and initiate gel formation during circulation. The material therefore requires filtered process water with hardness below 50 ppm as CaCO₃ and storage at 5–35 °C to avoid freeze-induced aggregation and microbiological growth.
Precision investment casting shell systems use silica sol as a refractory binder for zircon, fused silica, and alumina slurry formulations. Primary slurry formulations commonly combine 30 wt% silica sol with 325-mesh zircon flour at binder-to-flour ratios from 0.25:1 to 0.35:1 by mass. Slurry viscosity is controlled at 22–28 s on a Zahn #4 cup for primary dips and 12–18 s for secondary dips. Dip and stucco cycles are repeated to build shell thickness from 6 mm to 12 mm, with drying at 22–25 °C and 50–65% relative humidity. The sol gelation occurs through pH adjustment, electrolyte addition, or evaporative concentration. Compared with ethyl silicate binders, silica sol eliminates solvent hydrolysis and ethanol release but requires longer drying cycles and closer humidity control. Small-particle alkaline grades generate higher green strength and improved wetting on wax patterns; large-particle grades reduce shell cracking during rapid dewax because of lower drying shrinkage. In production shell rooms, binder demand is monitored because the sol must wet refractory grain without excessive foam or re-wetting of dried layers.
As an abrasive dispersion for oxide, silicon, and metal planarization, silica sol is diluted to 5–20 wt% solids with mean particle diameters of 30–80 nm and pH adjusted to 10.0–11.5 with potassium hydroxide or organic amines for oxide polishing. Particle size distribution width, controlled as a coefficient of variation below 10% by ISO 22412:2017, influences removal rate and defect density. Slurry formulation requires filtration through 0.5–1.0 µm depth filters to remove agglomerates and reduce microscratches. In semiconductor fabs, incoming slurry is monitored for large-particle counts by single-particle optical sensing; acceptance criteria are often set at fewer than 100 counts/mL for particles above 0.5 µm. Electronics-grade products require sodium, potassium, iron, and calcium each below 1 ppm. Because silica sol is softer than alumina or ceria abrasives, oxide removal rates are lower but post-polish defectivity is reduced. Handling equipment must avoid stainless steel corrosion at high pH and prevent contamination from amine-based cleaning agents that can cause gelation.
In high-solids coil coatings and waterborne wood finishes, silica sol is incorporated at 5–15 wt% on total binder solids to increase surface hardness and reduce blocking. Abrasion resistance is evaluated by Taber abraser according to ASTM D4060, adhesion by cross-cut tape test according to ASTM D3359, and pendulum damping hardness by ISO 1522. The sol must be blended under low-shear agitation; high-shear dispersion above 1500 rpm can destabilize large-particle grades and generate foam. Small-particle grades improve film transparency because particle diameter remains below visible light wavelengths, while particle loadings above 10 wt% can raise minimum film-forming temperature and reduce gloss. The dispersion is compatible with many anionic acrylic and polyurethane dispersions; cationic resin systems usually cause rapid aggregation because of charge neutralization.
Surface-modified silica sol grades are produced by condensation of organosilanes onto the particle surface, replacing silanol groups with organic functionality. Epoxy-functional grades are used in solventborne and radiation-curable coatings, where the organic surface reduces moisture sensitivity and improves compatibility with acrylate, urethane, and epoxy matrices. Vinyl-functional sols are used in free-radical cure systems. Typical surface coverage is reported as carbon content from 0.5 wt% to 3.0 wt%, with particle diameters of 10–25 nm and pH 4.0–7.0. Compared with sodium-stabilized sols, surface-modified grades show lower conductivity, narrower compatibility with waterborne anionic dispersions, and higher tolerance to nonpolar solvent systems. The organic surface reduces silanol condensation and can increase shelf stability in coatings over periods of 6–12 months when stored at 5–25 °C. In electronic polishing applications, surface modification controls particle-to-wafer adhesion and defect formation. Published data for specific wafer-level defectivity rates on advanced-node copper barrier applications is limited; incoming QC for these grades typically monitors particle size distribution, zeta potential according to ISO 13099-2:2012, and cation contamination below 1 ppm for Na and K.
Sodium silicate solutions carry SiO₂:Na₂O weight ratios from 2.0 to 3.4, pH from 11.0 to 13.0, and consist of monomeric and oligomeric silicate ions. Silica sol at 30 wt% SiO₂ contains Na₂O below 0.6 wt%, yielding substantially lower soluble salt content. Fumed silica is produced by flame hydrolysis of silicon tetrachloride or silane, forming branched, aggregated particles with BET surface area typically 90–300 m²/g and primary particle size 7–40 nm; it is not supplied as a stable aqueous dispersion. Precipitated silica is produced by acidulation of sodium silicate under controlled precipitation, yielding large agglomerates with median particle diameter from 5 µm to 100 µm, tapped density 150–250 g/L, and BET surface area 100–200 m²/g. Because silica sol is discrete nanospheres in water, it delivers higher particle packing, lower dried porosity, and more uniform film formation in thin coatings. In a coatings matrix, fumed silica increases low-shear viscosity and thixotropy, while colloidal silica at the same silica content usually exhibits Newtonian behaviour below 10 mPa·s and contributes to surface scratch resistance and anti-blocking. In investment casting, sodium silicate binders are lower cost and air-set by CO₂ gassing, but they introduce high sodium oxide flux that degrades refractory performance above 1200 °C. Silica sol shells retain dimensional accuracy and chemical inertness at higher firing temperatures, with sodium oxide below 0.5 wt% in the dried shell matrix. In comparison with ethyl silicate systems, silica sol releases no ethanol hydrolysis by-product and is not flammable, but it requires longer drying times and stricter humidity control.
The product is released against a specification sheet aligned with ISO and ASTM methods. Incoming quality control at manufacturing sites verifies non-volatile matter, pH, viscosity, particle size, and ionic impurities. Batch-to-batch variance in commercial production is controlled by statistical process control; typical coefficient of variation for solids content is below 1%, pH variation is within ±0.2 pH units, and mean particle diameter variation is within ±2 nm for small-particle grades. A compliance matrix is shown below.
| Parameter | Test method | Typical acceptance range |
|---|---|---|
| Non-volatile matter | ISO 3251:2019 | 15–50 wt% by grade |
| pH | ASTM E70 | 2.0–11.0 by grade |
| Viscosity | ASTM D2196 | < 10 mPa·s at 25 °C |
| Mean particle diameter | ISO 22412:2017 | 3–130 nm by grade |
| Specific surface area | ISO 9277:2022 | 40–600 m²/g by grade |
| Sodium content | ISO 10304-1:2007 | < 0.6 wt% Na₂O alkaline; < 1 ppm electronics |
| Chloride content | ISO 10304-1:2007 | < 500 ppm acidic; < 1 ppm electronics |
| Zeta potential | ISO 13099-2:2012 | Sign-dependent by grade; typically < -30 mV alkaline or > +20 mV acidic |
Operational boundaries govern use of silica sol. The product must not be stored below 0 °C, because ice crystal formation can irreversibly aggregate nanoparticles; if frozen, redispersion is generally not possible without high-shear milling. Dilution must be performed with deionized water; use of hard water can introduce Ca²⁺ and Mg²⁺ at concentrations above 50 ppm and reduce stability. Direct mixing with strong mineral acids or alkali at high local concentration can generate viscosity spikes and gel formation, so pH adjustment should be performed under agitation with dilute solutions. The material is incompatible with anhydrous organic solvents unless formulated with a surface-modified grade. The liquid product is not classified as flammable under normal transport conditions; dried films can create dust subject to occupational exposure limits for amorphous silica, and dust from finishing operations requires exposure controls. In coatings and investment casting, high humidity above 70% prolongs drying and can reduce shell build reproducibility, while rapid drying below 30% relative humidity can cause surface skinning and cracking of thick films. Equipment contact surfaces should be 316L stainless steel, polyethylene, or polypropylene; carbon steel is not recommended for long-term alkaline storage because of iron contamination and corrosion product formation.